0.5-24P FG
Manufacturer
Model
0.5-24P FG
Category
BOOMELE C20688 is a 0.5mm pitch 24-pin surface mount flexible connector specially designed for compact devices, suitable for environments of -40℃ to 85℃, achieving ±0.1mm insertion and extraction accuracy through optimized right-angle structure and bottom contact technology, and demonstrating high reliability connection performance in wearable devices and medical equipment fields.
Reference Pricing
Reference Stock
Specifications
Bending Radius | 1.50mm |
Contact Resistance | 10mΩ |
Data Transfer Rate | 1.5Gbps |
Dimensions | Varies by the number of pins |
Insulation Resistance | ≥5000MΩ |
Material | Copper Alloy |
Number of Contact Pairs | 24 |
Number of Insertion/Extraction Cycles | 1000 cycles |
Operating Temperature Range | -40℃ to +85℃ |
Operating Voltage | 3.3V |
Pin Pitch | 2.60mm |
Voltage Rating | 5V |
Function And Role
Core Function
Provide a connection between 24-pin flexible printed circuit boards and rigid printed circuit boards
Key Characteristics
- 0.5mm pitch
- surface mount
- bottom contact
- right-angle design
- 0.3mm flexible cable thickness
Application Domains
Basic Scenarios
- flexible circuit connections for wearable devices
- internal connections for medical equipment
- lightweight interfaces for consumer electronics
Extended Scenarios
- modular connections for automotive electronics
- waterproof interfaces for industrial equipment
- flexible connections for robot joints
Precautions
Soldering | When using reflow soldering, the temperature should be controlled between 250-280℃ and maintained for 10-15 seconds |
Current Limit | Maximum continuous current 2A (peak 4A) |
Voltage Limit | Voltage withstand 300VDC |
Thermal Management | Operating temperature -40℃ to 85℃ |
Storage | Store in a light-proof and dry environment, relative humidity <30% |
Risk Warnings |
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Alternative Model Params
- Pitch (0.5±0.05mm)
- Pin count (20-30P)
- Contact resistance (<50mΩ)
- Insulation voltage (≥500VDC)
Design Recommendations
Layout | Reserve 2mm mechanical clearance in PCB layout |
Thermal | When used with heat sinks, an increase of more than 3℃ in temperature difference is required |
Compatibility | Compatible with flexible substrates with a thickness of 0.3-0.5mm |
Testing | 500 insertion and extraction tests are required after welding |
Market Positioning
Strengths |
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Weaknesses |
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