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UB21F-B011-HLRG23-P
Reference Pricing
6+ :$0.112
60+ :$0.1106
192+ :$0.1092
Reference Stock
Available:125
Specifications
| Compatibility | Specific compatibility not provided |
| Contact Material | Ni Plating |
| Contact Resistance | 30mΩ MAX. |
| Data Transfer Rate | 30V DC |
| Dimensions | Specific dimensions not provided |
| Interface Type | USB2.0AF DIP Type Soldering Pad |
| Operating Temperature Range | Specific operating temperature range not provided |
| Pin Count | 5 |
| Rated Voltage | Specific rated voltage not provided |
| Weight | Specific weight not provided |
Datasheet
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Distributors
Shenzhen Hongkai Xuan Technology Co., Ltd.
RFQ
Shenzhen Shengsheng Electronic Co., Ltd.
RFQ
Shenzhen Bailing Microelectronics Co., Ltd.
RFQ
Dongguan Boteng Electronic Technology Co., Ltd.
RFQ
Shenzhen Huqiu Electronic Co., Ltd.
RFQ
Beijing Jinminfa Electronic Components Sales Center
RFQ
Shenzhen Qianru Electronic Co., Ltd.
RFQ
Shenzhen Futian District Wanshunxingda Electronic Business
RFQ
Shenzhen LEBIGAO Technology Co., Ltd.
RFQ
Shenzhen Yaxing Electronic Trading Co., Ltd. (Individual)
RFQ
Yinuoyi Instrument (China) Co., Ltd.
RFQ