00501-UCAF006-X
Manufacturer
Model
00501-UCAF006-X
Category
MINTRON 00501-UCAF006-X is a RoHS-compliant SMD USB connector with a compact packaging design, suitable for high-density PCB layouts in consumer electronics and industrial equipment. Its maximum carrying current of 2.0A and 5000 insertion/removal life meet the requirements of USB 2.0 standard, achieve cost optimization through step pricing, but pay attention to the minimum order quantity and overseas inventory turnover efficiency.
Reference Pricing
Reference Stock
Specifications
| Compatibility | Specific compatibility not found in the provided text |
| Contact Material | Copper, Gold Plated |
| Contact Resistance | 10Ω |
| Data Transfer Rate | SuperSpeed |
| Dimensions | Specific dimensions not found in the provided text |
| Interface Type | Type-C |
| Operating Temperature Range | -55℃ to +85℃ |
| Pin Count | 24 |
| Rated Voltage | 100V AC |
| Weight | Specific weight not found in the provided text |
Function And Role
Core Function
SMD USB connector for device connectivity
Key Characteristics
- SMD packaging
- RoHS compliance
- compact design
Application Domains
Basic Scenarios
- Consumer electronic devices (smartphones, tablets)
- Computer peripherals (keyboards, mice)
Extended Scenarios
- Industrial automation equipment
- Automotive electronic interfaces
- Internet of Things terminals
Precautions
| Soldering | Reflow soldering process required (peak temperature ≥220°C) |
| Current Limit | Maximum continuous current 2.0A (compliant with USB 2.0 standard) |
| Voltage Limit | Operating voltage range 5V±5% |
| Thermal Management | Power density needs to be matched with heat dissipation design (recommended thermal resistance <50℃/W) |
| Storage | Humidity <10% environment, avoid static discharge |
| Risk Warnings |
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Alternative Model Params
- Insertion/removal cycles (≥5000 times)
- Contact resistance (<50mΩ)
- Dimensions (0.6×0.3×0.1mm)
Design Recommendations
| Layout | PCB layout needs to reserve a 0.5mm pad expansion area |
| Thermal | Increase a 0.3mm copper foil heat dissipation layer is recommended in high-load scenarios |
| Compatibility | Matching with USB 2.0/3.0 interface specifications required |
| Testing | 500 insertion/removal tests must be conducted to verify life span |
Market Positioning
| Strengths |
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| Weaknesses |
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