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Specifications
| hole_size_in_sheet | 2.41 |
| hole_size_in_sheet_plus_0_08 | 3.18 |
| length_code_h | 2.5 |
| liquidous_temperature | 217°C |
| od_min_solder_pad | 3.66 |
| peak_package_body_temperature | see table |
| preheat_temperature_max | 200°C |
| preheat_temperature_min | 150°C |
| preheat_time | 60-120 seconds |
| ramp_down_rate | 6°C/second max. |
| ramp_up_rate | 3°C/second max. |
| rated_tightening_current | 15A |
| rated_tightening_current_a | 3.66 |
| sheet_thickness_max | 0.48 |
| sheet_thickness_min | 0.5 |
| thread_size_x_pitch | M1.6x0.35 |
| thru_hole | +0.10 |
| time_25_c_to_peak_temperature | 8minutes max. |
| time_maintained_above_t | 60-150 seconds |
| time_within_5_c_of_actual_peak_temperature | 20-30 seconds |
| torque | 15Kgf.cm |
Datasheet
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Shijiazhuang Lianqin Technology Development Co., Ltd.
Shenzhen Boyu Hengda Electronic Co., Ltd.
Shenzhen Jishengda Technology Co., Ltd.
Shenzhen Jianshun Electronics Co., Ltd.
Shenghetang (Shenzhen) Electronics Technology Co., Ltd.
Shenzhen Shenshen Microelectronics Technology Co., Ltd.
Shenzhen Deli Xin Cheng Technology Co., Ltd.
Beijing Minghui Fengshang Technology Co., Ltd.
Shenzhen Futian District Ruitai Microelectronics Merchants
Shenzhen Yueli Hang Technology Co., Ltd.
Shenzhen SMIC Equipment Co., Ltd.
Shenzhen Zhengyuan Ding Tai Technology Co., Ltd.