Jilin Huawei
Huawei Microelectronics operates multiple production lines for power semiconductor discrete devices and IC chips, including 4-inch, 5-inch, and 6-inch lines, with an annual chip processing capacity of 3.3 million units and packaging capacity of 2.4 billion units per year. The company holds numerous patents in terminal design, process manufacturing, and product design. Its product series utilize core manufacturing technologies such as IGBT, MOS, bipolar technology, and integrated circuits. Mainly producing power semiconductor devices and ICs, the company serves applications in automotive electronics, power electronics, photovoltaic inverters, industrial control, and LED lighting. Currently, the company has established product lines centered on IGBT, VDMOS, FRED, SBD, BJT, and IPM, positioning itself as a power semiconductor device solutions provider and an LED lighting solutions provider in the industry.
Product Models
Distributors
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