0132M4-26.1522F15DTNJK
Model
0132M4-26.1522F15DTNJK
Category
The C20528803 SMD crystal provides a stable 26.1522MHz frequency with ±10ppm tolerance at 25°C and ±30ppm stability across its -40°C to +85°C operational range, making it suitable for precision timing in consumer electronics and communication systems. Its 15pF load capacitance and SMD3225-4P package ensure reliable assembly in compact designs, while thermal management requirements necessitate proper copper pour and solder profile adherence.
Reference Pricing
Reference Stock
Specifications
| Frequency Accuracy | ±10ppm / ±20ppm / ±30ppm |
| Load Capacitance | 6 ~ 32pF |
| Load Resistance | <100Ω |
| Operating Temperature Range | -20 to +70°C |
| Package Type | SMD3225-4P |
| Quality Factor | ±10ppm ±15ppm |
| Resonant Frequency | 8.000 ～ 60.000MHz |
| Temperature Coefficient | ±10ppm ±15ppm |
Function And Role
Core Function
Generate precise frequency signals for electronic circuits
Key Characteristics
- 26.1522MHz frequency
- ±10ppm frequency tolerance at 25°C
- ±30ppm frequency stability
- 15pF load capacitance
- SMD3225-4P surface mount package
- Operating temperature range -40°C to +85°C
Application Domains
Basic Scenarios
- Communication modules
- Consumer electronics
- Microcontroller clock sources
Extended Scenarios
- GPS receiver chips
- IoT sensor nodes
- Wireless communication devices
Precautions
| Soldering | Use reflow soldering with 250-280°C peak temperature and 20-30s per pad |
| Current Limit | Max continuous current 50mA (absolute maximum 100mA) |
| Voltage Limit | Survives 200V ESD strikes per IEC 61000-4-2 |
| Thermal Management | Thermal resistance 40°C/W, require 10x10mm copper pad for heat dissipation |
| Storage | Store in anti-static bags at 10-40°C with <10% humidity |
| Risk Warnings |
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Alternative Model Params
- Frequency (26.1522±0.1MHz)
- Tolerance (±10ppm max)
- Capacitance (15±1pF)
- Package (SMD3225-4P)
- Operating temp (-40°C to +85°C)
Design Recommendations
| Layout | Keep crystal traces <5mm with 1mm spacing from power lines |
| Thermal | Add 0.5mm copper pour under component |
| Compatibility | Verify with 0.1mm pitch PCBs and 3+ layer boards |
| Testing | Perform 500 cycle thermal cycling test (-40°C to +85°C) before final assembly |
Market Positioning
| Strengths |
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| Weaknesses |
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